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Websites using wafer foundry as a keyword

Here you can see a list of websites which are using wafer foundry as keyword according to our database.

 
Websites found: 10
Number of websited displayed: 10
 

Queries in the same category:

 

List of results:

The Most Advanced Pure Play US Foundry | SkyWater Technology Foundry
http://site-overview.com/stats/skywatertechnology.com
SkyWater Technology Foundry is a right-sized, pure play foundry that helps innovative companies design, build & scale semiconductor wafer-based technologies.
  • Google Analytics ID: 92690569-1
  • Website Address renewal date: 18/3/4
  • Domain Address Reg. date: 17/3/3
  • Website address in use until: 19/3/3
Newport Wafer Fab are the world’s first CS & Silicon foundry
http://site-overview.com/stats/newportwaferfab.co.uk
Newport Wafer Fab is a high volume 200mm wafer fab, with a fast and agile ‘semiconductor production’ service for the CS cluster and the wider foundry market
  • Google Analytics ID: 77550291-34
  • Website Address renewal date: 17/9/14
  • Domain Address Reg. date: 17/9/14
  • Website address in use until: 18/9/14
EpiWorks, Inc. - High-Performance Epitaxial Wafers - A Generation Ahead
http://site-overview.com/stats/epiworks.com
EpiWorks is focused on one thing: manufacturing the best compound semiconductors on the planet. With technology that is a generation ahead, EpiWorks offers reliable large-volume production of high-performance GaAs- and InP-based epitaxial wafers.
  • Google Analytics ID: 52120283-1
  • Website Address renewal date: 16/8/8
  • Domain Address Reg. date: 98/6/2
  • Website address in use until: 19/6/1
HteLabs: Bipolar, Wafer Foundry, ASIC Design, SiCr Thin Film Resistors
http://site-overview.com/stats/htelabs.com
Research and Development Laboratories for semiconductor optoelectonics sensors microwave thin film active and passive components
  • Website Address renewal date: 15/7/29
  • Domain Address Reg. date: 99/3/10
  • Website address in use until: 20/3/10
MEMS Foundry and Wafer Services - Rogue Valley Micro
http://site-overview.com/stats/roguevalleymicrodevices.com
Our 200mm precision MEMS Foundry specializes in MEMS device fabrication. Silicon Wafer Services include LPCVD Nitride, Oxide, Metal and Resist Spray Coat
  • Google Analytics ID: 32906993-11
  • Website Address renewal date: 16/5/16
  • Domain Address Reg. date: 14/7/1
  • Website address in use until: 17/7/1
Gold chip technology for known good die, flip chip, bare die, wafer foundry for discrete semiconductors, integrated circuits and integrated passive components from Semiconix Semiconductor
http://site-overview.com/stats/aborn-electronics.com
  • Website Address renewal date: 15/7/29
  • Domain Address Reg. date: 09/10/20
  • Website address in use until: 20/10/20
Yole Développement, MEMS, Compound Semiconductors, Advanced Packaging, PV, 3D-IC, LED, Optoelectronics, Power Electronics, Microfluidic, Imaging, CMOS image sensors, CIS, technology market research technology analysis strategy consulting firm - HOME
http://site-overview.com/stats/yole.fr
Yole Développement MEMS Compound Semiconductors Advanced Packaging PV 3D-IC LED Optoelectronics Power Electronics Microfluidic technology market research technology analysis strategy consulting firm
  • Google Analytics ID: 272397-1
  • Website Address renewal date: 16/10/14
  • Domain Address Reg. date: 99/8/9
  • Website address in use until: 17/10/14
Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.
http://site-overview.com/stats/theil.com
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
  • Google Analytics ID: 23981464-1
  • Website Address renewal date: 12/11/21
  • Domain Address Reg. date: 97/1/1
  • Website address in use until: 21/12/31
Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.
http://site-overview.com/stats/theil.com.tw
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
  • Google Analytics ID: 23981464-1
  • Website address in use until: 19/5/31
  • Domain Address Reg. date: 97/5/1
Mirror Semiconductor M-QFN preplated NiPdAu Open Air Cavity QFN Protype IC packaging for MPW Multi-Project wafer MPW foundry shuttle service. Wafer foundries. Pre moulded. Chip Assembly, Chip packages , Open Cavity QFN... . . . . M-QFN8W.65-G5 , M-QFN12W.5-G6 , M-QFN12W.65-G6 , M-QFN12W.8-G6 , M-QFN16W.5-AE , M-QFN16W.5-G6 , M-QFN16W.65-G5 , M-QFN16W.8-G6 , M-QFN20W.4-G6 , M-QFN20W.5-G5 , M-QFN20W.65-G6 , M-QFN20W.8-G6 , M-QFN24W.5-G6 , M-QFN24W.65-G6 , M-QFN24W.8-G6 , M-QFN28W.4-G3 , M-QFN28W.4-G6 , M-QFN28W.5-G6 , M-QFN28W.65-G6 , M-QFN28W.8-G6 , M-QFN32W.5-AE , M-QFN32W.5-G6 , M-QFN32W.65-G6 , M-QFN32W.8-G6 , M-QFN36W.4-G6 , M-QFN36W.5-G6 , M-QFN40W.4-G5 , M-QFN40W.5-G6 , M-QFN40W.65-G6 , M-QFN44W.5-G6 , M-QFN44W.65-G6 , M-QFN48W.4-G5 , M-QFN48W.5-AE , M-QFN48W.5-G6 , M-QFN52W.5-G6 , M-QFN56W.4-G6 , M-QFN56W.5-G5 , M-QFN64W.4-G6 , M-QFN64W.5-G5 , M-QFN68W.4-G6 , M-QFN68W.5-G6 , M-QFN72W.4-G6 , M-QFN72W.5-G5 , M-QFN76W.4-G6 , M-QFN80W.5-G5 , M-QFN88W.4-G3 , M-QFN88W.4-G6 , M-QFN100W.4-G3 , M-QFN100W.4-G6 . . . . 460850 , 451260 , 451660 , 451670 , 461650 , 452050 , 452460 , 453260 , 453270 , 444050 , 454060 , 444850 , 454860 , 454870 , 455650 , 456450 , 457250 , 458050 , 461260 , 481260 , 481660 , 442060 , 462060 , 482060 , 462460 , 482460 , 442860 , 442830 , 452860 , 462860 , 482860 , 463260 , 483260 , 443660 , 453660 , 464060 , 454460 , 464460 , 455260 , 445660 , 446460 , 446860 , 456860 , 447260 , 447660 , 448860 , 448830 , 449960 , 449930 . . . . Footprints match OmPP and OCPP and Open-Pak OCP , DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B , Microelectronic semiconductor assembly, pkg parts, packaging, packages, . . . IC assembly, assemblies, assembly packaging and test Ball bonding, Wire bonding , microelectronics , wedge bonding. Die bonding , die bond process, die bonder machine. Chip scale package, RF IC design , RFIC design. MEMSic , MEMS Package Packaging , semiconductors , foundry services, foundries , wafers , Wafer dicing , chip carrier package, chip die ,
http://site-overview.com/stats/mirrorsemi.com
Open Air Cavity QFN Package. Organic Open Cavity for MEMS, RF, Sensors and Semiconductors.
  • Website Address renewal date: 17/1/24
  • Domain Address Reg. date: 06/4/13
  • Website address in use until: 20/4/13
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