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Websites using mems packaging as a keyword

Here you can see a list of websites which are using mems packaging as keyword according to our database.

 
Websites found: 20
Number of websited displayed: 20
 

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List of results:

Plasma-Therm Home
http://site-overview.com/stats/plasmatherm.com
Plasma-Therm designs and manufactures plasma etch and deposition systems, including ICP, RIE, DSE, PECVD, and HDPCVD for die singulation, solid-state lighting, wireless, MEMS/NEMS, data storage, renewable energy, nanotechnology, photomask, and photonics.
  • Google Analytics ID: 16542352-1
  • Website Address renewal date: 09/2/1
  • Domain Address Reg. date: 97/1/31
  • Website address in use until: 19/2/1
Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.
http://site-overview.com/stats/theil.com
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
  • Google Analytics ID: 23981464-1
  • Website Address renewal date: 12/11/21
  • Domain Address Reg. date: 97/1/1
  • Website address in use until: 21/12/31
EVG|EVGroup.com
http://site-overview.com/stats/evgroup.com
EV Group (EVG) targets advanced packaging, compound semiconductor and silicon-based power devices, MEMS, nanotechnology and SOI markets with its industry-leading wafer-bonding, lithography/nanoimprint lighography (NIL), metrology, photoresist coating, cleaning and inspection equipment.
  • Google Analytics ID: 738088-2
  • Website Address renewal date: 09/7/30
  • Domain Address Reg. date: 99/7/30
  • Website address in use until: 19/7/30
Chip Scale Review
http://site-overview.com/stats/chipscalereview.com
  • Website Address renewal date: 17/3/21
  • Domain Address Reg. date: 98/5/21
  • Website address in use until: 18/5/20
Plasma-Therm Home
http://site-overview.com/stats/plasma-therm.com
Plasma-Therm designs and manufactures plasma etch and deposition systems, including ICP, RIE, DSE, PECVD, and HDPCVD for die singulation, solid-state lighting, wireless, MEMS/NEMS, data storage, renewable energy, nanotechnology, photomask, and photonics.
  • Google Analytics ID: 16542352-1
  • Website Address renewal date: 09/10/28
  • Domain Address Reg. date: 07/10/28
  • Website address in use until: 19/10/28
HOME | SPT Micro
http://site-overview.com/stats/sptmicro.com
SPT Microtechnologies USA, Inc. (SPT) is a leading supplier of oxidation, diffusion, LPCVD and APCVD technologies for Semiconductor, Power, MEMS, III-V and packaging applications.
  • Website Address renewal date: 15/8/28
  • Domain Address Reg. date: 15/7/7
  • Website address in use until: 20/7/7
Yole Développement, MEMS, Compound Semiconductors, Advanced Packaging, PV, 3D-IC, LED, Optoelectronics, Power Electronics, Microfluidic, Imaging, CMOS image sensors, CIS, technology market research technology analysis strategy consulting firm - HOME
http://site-overview.com/stats/yole.fr
Yole Développement MEMS Compound Semiconductors Advanced Packaging PV 3D-IC LED Optoelectronics Power Electronics Microfluidic technology market research technology analysis strategy consulting firm
  • Google Analytics ID: 272397-1
  • Website Address renewal date: 16/10/14
  • Domain Address Reg. date: 99/8/9
  • Website address in use until: 17/10/14
Frontier Semiconductor
http://site-overview.com/stats/frontiersemi.com
  • Google Analytics ID: 111443041-1
  • Website Address renewal date: 17/6/6
  • Domain Address Reg. date: 96/8/5
  • Website address in use until: 22/8/4
Mechanical Design Engineering Resources on the World Wide Web
http://site-overview.com/stats/gearhob.com
  • Website Address renewal date: 15/8/7
  • Domain Address Reg. date: 01/12/28
  • Website address in use until: 20/12/28
(사)마이크로나노시스템학회 (The Society of Micro and Nano Systems)
http://site-overview.com/stats/micronanos.org
사단법인 마이크로나노시스템학회(The Society of Micro and Nano Systems)는 MEMS 또는 나노 시스템 관련분야의 제반 학술연구 및 학술과 기술의 발전, 보급에 기여하며, 국내외 관련 산학연기관과 협력을 도모하여 제반 분야의 과학과 기술의 진흥을 통해 국가 및 사회에 기여함을 목적으로 하고 있으며, 특히 MEMS 기술과 나노기술을 기반으로 정보통신(IT), 바이오 메디컬(BT, MT), 환경 및 에너지 (CT, ET)등 다양한 분야와 기술적으로 연계된 융합연구를 지향하는 학회입니다. 마이크로나노시스템학회에서는 년 4회 Micro and Nano Systems Letters (MNSL) 학술지를 발간하고 있습니다. 논문 제출분야는 아래와 같습니다. Micro & Nano Fabrication Technologies. Packaging Technologies, Materials and Device Characterization, Mechanical Sensors and Systems, Physical (Optical, Magneto) Devices, RF MEMS, Bio and Chemical Sensors and Systems, Medical Microsystems, Micro & Nano Fluidic Components and Systems, Micro & Nano Actuators, Energy Harvesting and Power Systems, Nano-Electro-Mechanical Devices and Systems. The Society of Micro and Nano Systems (SMNS) is an organization contributing to the development and distribution of academic research and technology related to microelctromechnaical systems (MEMS) and nano-systems. Specifically, it aims to help the collaboration among industries, academic societies, and research centers to promote science and technology related to MEMS and nano-systems and finally contributes to the development of human society. Based on MEMS and nanotechnology, the SMNS strongly encourages multidisciplinary researches encompassing various areas including but not limited to the information technology (IT), biotechnology (BT), medical technology (MT), environmental and energy technology (CT, ET).
  • Website Address renewal date: 15/11/4
  • Domain Address Reg. date: 12/2/29
  • Website address in use until: 24/2/29
Glass Wafers, Fused Silica Wafers and substrates from Plan Optik AG
http://site-overview.com/stats/planoptik.com
Plan Optik manufactures MEMS packaging wafers from glass, silicon and glass-silicon compounds as well as process carriers for thin GaAs and silicon wafers. Substrate wafers are available from stock.
  • Website Address renewal date: 17/9/7
  • Domain Address Reg. date: 96/9/7
  • Website address in use until: 18/9/6
Mirror Semiconductor M-QFN preplated NiPdAu Open Air Cavity QFN Protype IC packaging for MPW Multi-Project wafer MPW foundry shuttle service. Wafer foundries. Pre moulded. Chip Assembly, Chip packages , Open Cavity QFN... . . . . M-QFN8W.65-G5 , M-QFN12W.5-G6 , M-QFN12W.65-G6 , M-QFN12W.8-G6 , M-QFN16W.5-AE , M-QFN16W.5-G6 , M-QFN16W.65-G5 , M-QFN16W.8-G6 , M-QFN20W.4-G6 , M-QFN20W.5-G5 , M-QFN20W.65-G6 , M-QFN20W.8-G6 , M-QFN24W.5-G6 , M-QFN24W.65-G6 , M-QFN24W.8-G6 , M-QFN28W.4-G3 , M-QFN28W.4-G6 , M-QFN28W.5-G6 , M-QFN28W.65-G6 , M-QFN28W.8-G6 , M-QFN32W.5-AE , M-QFN32W.5-G6 , M-QFN32W.65-G6 , M-QFN32W.8-G6 , M-QFN36W.4-G6 , M-QFN36W.5-G6 , M-QFN40W.4-G5 , M-QFN40W.5-G6 , M-QFN40W.65-G6 , M-QFN44W.5-G6 , M-QFN44W.65-G6 , M-QFN48W.4-G5 , M-QFN48W.5-AE , M-QFN48W.5-G6 , M-QFN52W.5-G6 , M-QFN56W.4-G6 , M-QFN56W.5-G5 , M-QFN64W.4-G6 , M-QFN64W.5-G5 , M-QFN68W.4-G6 , M-QFN68W.5-G6 , M-QFN72W.4-G6 , M-QFN72W.5-G5 , M-QFN76W.4-G6 , M-QFN80W.5-G5 , M-QFN88W.4-G3 , M-QFN88W.4-G6 , M-QFN100W.4-G3 , M-QFN100W.4-G6 . . . . 460850 , 451260 , 451660 , 451670 , 461650 , 452050 , 452460 , 453260 , 453270 , 444050 , 454060 , 444850 , 454860 , 454870 , 455650 , 456450 , 457250 , 458050 , 461260 , 481260 , 481660 , 442060 , 462060 , 482060 , 462460 , 482460 , 442860 , 442830 , 452860 , 462860 , 482860 , 463260 , 483260 , 443660 , 453660 , 464060 , 454460 , 464460 , 455260 , 445660 , 446460 , 446860 , 456860 , 447260 , 447660 , 448860 , 448830 , 449960 , 449930 . . . . Footprints match OmPP and OCPP and Open-Pak OCP , DFN3X3-08-OP-01-B, DFN3X3-10-OP-01-B, MLP3X3-12-OP-01-B, MLP3X3-16-OP-01-B, MLP4X4-12-OP-01-B, MLP4X4-16-OP-01-B, MLP4X4-20-OP-01-B, MLP4X4-24-OP-01-B, MLP5X5-16-OP-01-B, MLP5X5-16-OP-02-B, MLP5X5-20-OP-01-B, MLP5X5-24-OP-01-B, MLP5X5-28-OP-01-B, MLP5X5-32-OP-01-B, MLP6X6-24-OP-01-B, MLP6X6-28-OP-01-B, MLP6X6-36-OP-01-B, MLP6X6-40-OP-01-B, MLP7X7-28-OP-01-B, MLP7X7-32-OP-01-B, MLP7X7-44-OP-01-B, MLP7X7-48-OP-02-B, MLP8X8-28-OP-01-B, MLP8X8-32-OP-01-B, MLP8X8-52-OP-01-B, MLP8X8-56-OP-01-B, MLP9X9-44-OP-01-B, MLP9X9-64-OP-01-B, MLP12X12-80-OP-01-B, MLP12X12-100-OP-01-B, CL-MLP3X3-15-01, CL-MLP4X4-15-01, CL-MLP5X5-15-02, CL-MLP5X5-15-01, CL-MLP5X5-15-02, CL-MLP6X6-15-01, CL-MLP7X7-15-01, CL-MLP8X8-15-01, CL-MLP9X9-15-01, CL-MLP12X12-15-01, OCP_QFN_3X3_12A , OCP_QFN_3X3_16A , OCP_QFN_4X4_12A , OCP_QFN_4X4_16A , OCP_QFN_4X4_20A , OCP_QFN_4X4_24A , OCP_QFN_5X5_16A , OCP_QFN_5X5_20A , OCP_QFN_5X5_24A , OCP_QFN_5X5_28A , OCP_QFN_5X5_32A , OCP_QFN_6X6_24A , OCP_QFN_6X6_36A , OCP_QFN_6X6_40A , OCP_QFN_7X7_28A , OCP_QFN_7X7_32A , OCP_QFN_7X7_44A , OCP_QFN_7X7_48A , OCP_QFN_8X8_28A , OCP_QFN_8X8_32A , OCP_QFN_8X8_52A , OCP_QFN_8X8_56A , OCP_QFN_9X9_64A , OCP_QFN_12X12_100A , OCP_QFN_12X12_80A ,LQFP10X10-44OP-01-B , LQFP10X10-52OP-01-B , LQFP10X10-64OP-01-B , LQFP10X10-64OP-01 , OCP_LQFP44A , OCP_LQFP64A , OCP_SOIC_150_16A , OCP_SOIC_150_8A , OCP_SOIC_300_16B , OCP_SOIC_300_20A , OCP_SOIC_300_24A , OCP_SOIC_300_28A, OPC_SOIC16A , OPC_SOIC16B , OPC_SOIC20A , OPC_SOIC24A, OPC_SOIC28A , OPC_SOIC8A , SOIC016-OP-01 , SOIC016-OP-02 , SOIC020-OP-01 , SOIC024-OP-01 , SOIC028A_OP_01, SOIC08-OP-01 , OmPP, QP-QFN16-3mm-0.5mm , QP-QFN16-4mm-0.65mm , QP-QFN20-4mm-0.5mm , QP-QFN20-5mm-0.65mm , QP-QFN24-4mm-0.5mm , QP-QFN28-4mm-0.4mm , QP-QFN28-5mm-0.5mm , QP-QFN28-6mm-0.65mm , QP-QFN32-5mm-0.5mm , QP-QFN40-6mm-0.5mm , QP-QFN48-6mm-0.4mm , QP-QFN48-7mm-0.5mm , QP-QFN56-8mm-0.5mm , QP-QFN64-9mm-0.5mm , QP-QFN72-10mm-0.5mm , QP-QFN8-3mm-0.65mm , QP-QFN88-10mm-0.4mm , QP-QFN100-12mm-0.4mm , QFN5X5-2801 , QFN5X5-3201 , QFN7X7-4401 , QFN7X7-4801 , QFN8X8-5201 , QFN8X8-5601 , QFN9X9-6401 , POQ-S-0303-12-B , POQ-S-0303-16-B , POQ-S-0303-8-C , POQ-S-0404-16-C , POQ-S-0404-20-B , POQ-S-0404-24-B , POQ-S-0505-32-B , POQ-S-0505-40-A , POQ-S-0606-40-B , POQ-S-0606-48-A POQ-S-0707-48-B , POQ-S-0808-56-B , POQ-S-0909-64-B , POQ-S-1010-72-B , POQ-S-1212-80-B , Microelectronic semiconductor assembly, pkg parts, packaging, packages, . . . IC assembly, assemblies, assembly packaging and test Ball bonding, Wire bonding , microelectronics , wedge bonding. Die bonding , die bond process, die bonder machine. Chip scale package, RF IC design , RFIC design. MEMSic , MEMS Package Packaging , semiconductors , foundry services, foundries , wafers , Wafer dicing , chip carrier package, chip die ,
http://site-overview.com/stats/mirrorsemi.com
Open Air Cavity QFN Package. Organic Open Cavity for MEMS, RF, Sensors and Semiconductors.
  • Website Address renewal date: 17/1/24
  • Domain Address Reg. date: 06/4/13
  • Website address in use until: 20/4/13
Mission Technologies, Inc. - OEM Electronic Sales Representative
http://site-overview.com/stats/missiontechnologies.com
OEM Electronic and System Representative Company. Semiconductors, Power Supplies, Filters, EMI Shields, Circuit Board Shields, Microcontrollers, Microprocessors, Multi Core, Motor Control, Power ICs, Thermal Management, Heat Sinks, Heaters, Heat Pipes, keypads, touch panels, joysticks, security, packaging solutions, software development services, printed circuit boards, flex circuits, systems, military and aerospace products, displays, cables, product life management solutions, pressure sensors, MEMS, transformers XFMRS, pumps
  • Website Address renewal date: 17/8/2
  • Domain Address Reg. date: 98/8/18
  • Website address in use until: 18/8/17
MSG Lithoglas GmbH - Home
http://site-overview.com/stats/lithoglas.de
MSG Lithoglas GmbH, glass deposition
  • Website Address renewal date: 13/1/17
Contract Manufacturing for Microelectronic Packaging and Ceramic Thick Film / Thin Film Substrate Fabrication. | Tong Hsing Electronic Industries, Ltd.
http://site-overview.com/stats/theil.com.tw
The world–renowned leading provider of micro module assembly and thick film and thin film substrate foundry services - Tong Hsing.. Our strategic plan is to provide state-of-the-art microelectronic packaging and substrate technologies to various industries, such as wireless communications, MEMS, image sensors, optical electronics, high brightness LED, solar cell, fuel cell, automotive electronics, military, computer peripherals, medical and network equipment.
  • Google Analytics ID: 23981464-1
  • Website address in use until: 19/5/31
  • Domain Address Reg. date: 97/5/1
Sell and Buy Used Semiconductor Equipment, 150mm, 200mm, 300mm Semiconductor Wafer Fab Equipment
http://site-overview.com/stats/csisemi.com
Buy and Sell Used Semiconductor Equipment, Wafer Fab Equipment, MEMS, Packaging, LED, PV, Electronics, Flexible Hybrid
  • Google Analytics ID: 42165861-41
  • Website Address renewal date: 17/4/21
  • Domain Address Reg. date: 15/5/12
  • Website address in use until: 18/5/12
MicroChem: Innovative Chemical Solutions for MEMS and Microelectronics
http://site-overview.com/stats/microchem.com
MicroChem develops and manufactures specialty chemicals including photoresists and optical dyes for MEMS, displays, microelectronics, packaging, optoelectronics and other dynamic technology markets.
  • Google Analytics ID: 1574573-1
  • Website Address renewal date: 16/3/28
  • Domain Address Reg. date: 96/5/3
  • Website address in use until: 20/5/4
반도체네트워크
http://site-overview.com/stats/semiconnet.co.kr
Amplifiers,Circuit,Protection,Converters,Processors,Discrete,Parts,DSP,EDA,Embedded,EMI/ESD,Filters,FPGA,Interface,LED,Controllers,Memory,MEMS,Network,Optoelectronics,Oscillators,Packaging,PMIC,Power,Supplies,RF/IF,and,RFID,Regulators,Sensors,Solar/Energy,Switches,Test,Equipment,Tools,Charger
  • Google Analytics ID: 38085900-2
반도체네트워크
http://site-overview.com/stats/webcastlink.com
Amplifiers,Circuit,Protection,Converters,Processors,Discrete,Parts,DSP,EDA,Embedded,EMI/ESD,Filters,FPGA,Interface,LED,Controllers,Memory,MEMS,Network,Optoelectronics,Oscillators,Packaging,PMIC,Power,Supplies,RF/IF,and,RFID,Regulators,Sensors,Solar/Energy,Switches,Test,Equipment,Tools,Charger
  • Google Analytics ID: 38085900-2
  • Website Address renewal date: 15/4/17
  • Domain Address Reg. date: 11/5/24
  • Website address in use until: 20/5/24
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